Sabrent Launches Rocket Nano M.2-2242 SSD: Up to 5 GB/sec
Sabrent tends to get into news when it launches ultra-high-performance SSDs for enthusiast-grade desktops, but this week the company introduced a completely different type of product: a small form-factor...
4 by Anton Shilov on 5/9/2024Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330
As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2...
13 by Anton Shilov on 5/8/2024Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings
Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel...
13 by Gavin Bonshor on 5/8/2024ASUS to Unveil First Qualcomm Snapdragon X Elite-Based Laptop On May 20th
Asus on Tuesday said that it would announce its first 'AI PC' based on Qualcomm's Snapdragon X Elite system-on-chips later this month. The new laptop is set to be...
8 by Anton Shilov on 5/7/2024Upcoming AMD Ryzen AI 9 HX 170 Processor Leaked By ASUS?
In what appears to be a mistake or a jump of the gun by ASUS, they have seemingly published a list of specifications for one of its key notebooks...
8 by Gavin Bonshor on 5/7/2024Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools
This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic...
8 by Anton Shilov on 5/3/2024SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix...
6 by Anton Shilov on 5/2/2024AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great
As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year...
41 by Anton Shilov on 5/1/2024PCI-SIG Completes CopprLink Cabling Standard: PCIe 5.0 & 6.0 Get Wired
The PCI-SIG sends word over this morning that the special interest group has completed their development efforts on the group’s new PCI-Express cabling standard, CopprLink. Designed to go hand-in-hand...
8 by Ryan Smith on 5/1/2024Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year
As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that...
4 by Anton Shilov on 5/1/2024TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's
TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies...
6 by Anton Shilov on 4/30/2024TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect
Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth...
9 by Anton Shilov on 4/26/2024TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips
TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have...
2 by Anton Shilov on 4/26/2024TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction
While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature...
6 by Anton Shilov on 4/25/2024TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells
Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain...
0 by Anton Shilov on 4/25/2024Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand
Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move...
11 by Anton Shilov on 4/24/2024Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years
As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the...
13 by Anton Shilov on 4/23/2024Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...
2 by Anton Shilov on 4/23/2024JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features
When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...
14 by Anton Shilov on 4/22/2024SK Hynix and TSMC Team Up for HBM4 Development
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...
5 by Anton Shilov on 4/19/2024