Memory

The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on...

Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die

The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging...

15 by Ganesh T S on 11/9/2023

Solidigm Lays Off Employees Due to Industry Downturn

The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and...

18 by Anton Shilov on 10/25/2023

Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones

Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory...

23 by Anton Shilov on 10/25/2023

Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps

Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...

10 by Ryan Smith on 10/20/2023

HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface

High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...

11 by Anton Shilov on 10/12/2023

Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...

7 by Anton Shilov on 9/28/2023

Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs

Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32...

9 by Anton Shilov on 9/28/2023

Corsair's Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s

Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together luxurious look, customizable design, and extreme data transfer...

1 by Anton Shilov on 9/26/2023

Modular LPDDR Memory Becomes A Reality: Samsung Introduces LPCAMM Memory Modules

Although Low Power DDR(LPDDR) memory has played a pivotal role in reducing PC laptop power usage, the drawback to the mobile-focused memory has always been its tight signaling and...

30 by Ryan Smith on 9/25/2023

Samsung Unveils Industry's First 32Gbit DDR5 Memory Die: 1TB Modules Incoming

Samsung early on Friday revealed the world's first 32 Gb DDR5 DRAM die. The new memory die is made on the company's 12 nm-class DRAM fabrication process and not...

6 by Anton Shilov on 9/1/2023

SK hynix Begins Sampling HBM3e, Volume Production Planned For H1 2024

SK hynix on Monday announced that it had completed initial development of its first HBM3E memory stacks, and has begun sampling the memory to a customer. The updated ("extended"...

4 by Anton Shilov on 8/21/2023

Samsung, MemVerge, and H3 Build 2TB CXL Memory Pool

Samsung, MemVerge, H3 Platform, and XConn have jointly unveiled their 2 TB Pooled CXL Memory System at the Flash Memory Summit. The device can be connected to up to...

4 by Anton Shilov on 8/14/2023

SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC

On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company's LPDDR5X-8500 devices...

10 by Anton Shilov on 8/11/2023

Memory Makers on Track to Double HBM Output in 2023

TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...

9 by Anton Shilov on 8/9/2023

SK Hynix Shows Off 321-Layer 3D TLC NAND Device

SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with...

11 by Anton Shilov on 8/9/2023

Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB

This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions. Modern server platforms from...

7 by Anton Shilov on 8/9/2023

TeamGroup Unveils JEDEC-Spec DDR5-6400 Memory Kits: Faster 1.1V DDR5 On The Way For Future CPUs

While DDR5 memory has been out and in use for a couple of years now, so far we haven't seen the memory reach its full potential – at least...

5 by Anton Shilov on 7/31/2023

Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND

Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...

14 by Anton Shilov on 7/28/2023

Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext

In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...

4 by Anton Shilov on 7/27/2023

Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors

Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...

7 by Anton Shilov on 7/26/2023

Log in

Don't have an account? Sign up now